Electrically Induced Stimuli For MEMS Self-Test

نویسندگان

  • Benoît Charlot
  • Salvador Mir
  • Fabien Parrain
  • Bernard Courtois
چکیده

A major problem for applying self-test techniques to MEMS is the multi-domain nature of the sensing parts that require special test equipment for stimuli generation. In this work we describe, for three different types of MEMS that work in different energy domains, how the required non-electrical test stimuli can be induced onchip by means of electrical signals. This provides the basis for adding BIST strategies for MEMS parts embedded in the coming generation of integrated systems. The first case corresponds to an accelerometer as a review of a classical example. The last two cases correspond to piezoresistive and infrared sensors that we use in innovative applications under development in our Laboratory, and for which the self-test methods are new to our knowledge. The last case is also illustrated as a complete application that corresponds to an infrared imager. The on-chip test signal generation proposed requires only slight modifications and allows a production test of the imager with a standard test equipment, without the need of special infrared sources and the associated optical equipment. The test function can also be activated off-line in the field for validation and maintenance purposes.

برای دانلود رایگان متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Generation of Electrically Induced Stimuli for MEMS Self-Test

A major task for the implementation of Built-In-Self-Test (BIST) strategies for MEMS is the generation of the test stimuli. These devices can work in different energy domains and are thus designed to sense signals which are generally not electrical. In this work, we describe, for different types of MEMS, how the required non-electrical test stimuli can be induced on-chip by means of electrical ...

متن کامل

Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment

Packaging is one of the major cost drivers for MEMS devices. Currently wire bonding is the dominant method for electrically connecting MEMS chips to substrate. Using self-alignment a method for packaging multiple MEMS at the same time has been developed. The presented process achieves high throughput and precise alignment at low cost. The Controlled Collapse Reflow Chip Joining (C-4) process ha...

متن کامل

Power Processing Circuits for Mems Inertial Energy Scavengers

Inertial energy scavengers are self-contained devices which generate power from ambient motion, by electrically damping the internal motion of a suspended proof mass. There are significant challenges in converting the power generated from such devices to useable form, particularly in micro-engineered variants. This paper presents approaches to this power conversion requirement, with emphasis on...

متن کامل

On-Chip Pseudorandom MEMS Testing

This paper presents a Built-In-Self-Test (BIST) implementation of pseudo-random testing for MEMS. The technique is based on Impulse Response (IR) evaluation using pseudo-random Maximum–Length Sequences (MLS). We will demonstrate the use of this technique for an on-chip fast and accurate broadband determination of MEMS behaviour, in particular for the characterisation of MEMS structures such as ...

متن کامل

Mems Built–in-self-test Using Mls Mems Built–in-self-test Using Mls

This paper presents a Built-In-Self-Test (BIST) implementation of pseudo-random testing for Micro ElectroMechanical Systems (MEMS). The technique is based on Impulse Response (IR) evaluation using Maximum–Length Sequences (MLS). We will demonstrate the use of this technique and move forward to find the signature that is defined as the necessary samples of the impulse response needed to carry ou...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2001